Reflow soldering

This paper introduces a production line which consists of manual reflow soldering tools according to the conditions of PCB design and production in our institute .

本文介绍了根据我所的PCB设计和生产情况配置的由OK公司的手工再流焊接工具组成的生产线，包括维修系统、热风焊笔、点胶机。

New Development of Reflow Soldering Heating Equipment

再流焊接加热设备的新进展

Software design of reflow soldering temperature measurement system based on VB

基于VB的回流焊温度测试系统软件设计

Simplified Decoupling Control on the Reflow Soldering Machine Heat Balance Mechanism Model

基于热风回流焊机热平衡机理模型的简化解耦控制

Automatic Management System of Solder Joint Reliability in Reflow Soldering

再流焊焊点可靠性自动管理系统

Research status of reflow soldering technology in microelectronic packaging and assembly

微电子封装与组装中的再流焊技术研究进展

The thermal Distortion Simulation of Lead Free PCB Assembly During Reflow Soldering Process

回流焊中常见的缺陷&锡珠无铅PCB组件再流焊焊接工艺的热变形仿真分析

The Research of Reflow Soldering On the Kinetic Process of Soldering

锡焊动态过程的研究

Dynamic Modeling and Simulation for Multiple Temperature Zones System of Reflow Soldering Machine Based on Heat Balance Mechanism

基于热平衡机理的热风回流焊机多温区系统动态建模及仿真

Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering

无铅回流焊冷却速率对焊点质量的影响实施倒装芯片的组装

Analysis of thermal stress and hygrothermal stress for SiP device in reflow soldering

SiP器件回流焊时湿热应力的分析

Research the Compatibility of Lead Free Reflow Soldering

无铅再流焊的兼容性研究

Study on Improving the Joint Quality of Reflow Soldering for Large Dimension Copper-Clad Laminates

提高大面积敷铜箔板再流焊接质量的研究

Statistical Process Control of Reflow Soldering

再流焊工艺的统计过程控制

Please follow " Reflow Soldering Conditions " in catalogue .

请遵守产品目录中的回流焊条件。

This paper summarizes the BGA property and repairable process after hot air reflow soldering .

该文综述了BGA元器件的特性和其返修工艺。

Mounting Membrane Combined IC with Reflow Soldering Technology

用再流焊技术组装薄膜混合集成电路

Sn-Cu-Bi Alloy Plating Bath Tin Ball in Reflow Soldering Process Formation

锡-铜-铋合金电镀液回流焊中常见的缺陷&锡珠

The application of reflow soldering and SMT in R & D and production

回流焊接工艺与表面贴装技术在科研生产中的应用

In the end , PLC and temperature sensors are used to complete the reflow soldering temperature control and detection .

采用PLC和温度传感器完成对回流焊温度的现场检测和控制，达到了工艺要求。

Design stencil according to requirement of inserter soldering quality and reflow soldering technology .

根据插件焊接质量的要求，按照回流焊工艺设计印刷模板。

The Formation and Prevention of the Soldering Balls at Reflow Soldering

再流焊锡珠的形成与预防

HOT BARThe hot wire is widely used in welding , solder reflow soldering .

广泛应用于线材的热压焊、焊锡焊接的回流焊，IC贴片。

SMD lamp beads , manufactured through full automatic reflow soldering line .

贴片灯珠，全自动化回流焊生产；

The recent work about the modeling and simulating of reflow soldering process home and abroad are introduced in the paper .

主要介绍了国内外再流焊工艺建模与仿真研究现状。

Pin - through - hole Reflow Soldering Technology

通孔再流焊技术

Thermal impact to PCBA during reflow soldering is considered one of the main drivers for manufacturing defects .

在再流焊过程中受到热冲击已成为PCB组件生产过程中产生缺陷的主要原因之一。

Effect of Temperature , Moisture and Vapor Pressure on Delamination in a PBGA During Reflow Soldering Process

回流焊过程温度、潮湿和蒸汽压力对PBGA分层的影响

What other issues can be expected with the conversion to lead-free reflow soldering ?

转变到无铅回流焊接还会遇到什么问题？

Probe into Reflow Soldering Process

回流焊工艺探讨